Wafer Bonding: Applications and Technology (Softcover Reprint of the Original 1st 2004)Paperback - Softcover Reprint of the Original 1st 2004, 30 September 2011

The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.