The power and thermal management/balancing is of increasing concern and
is a technological challenge to the multi-core processor (MCP)
development and will be a main performance bottleneck for the
development of MCPs. The work presented in this thesis discusses the
thermal and power management of MCPs with both two dimensional (2D)
package and three dimensional (3D) package chips. For 2D package chips,
a group of one dimensional (1D) partial differential equations (PDEs),
which is derived from the 3D PDE heat conduction equation, is proposed
to describe the thermal behavior of each core. Thereafter, an optimal
controller is designed to manage the power consumption and balance the
temperature among the cores based on the proposed 1D model. Different
from 2D package chips, a liquid cooling system should be installed among
the layers to reduce the internal temperature of 3D chips. Due to the
complexity of the system, the thermal behavior of the whole system is
modeled as an ordinary differential equation (ODE) system. For balancing
the temperature a two step control policy is proposed. In the first step
the micro-channel liquid velocity is set based on a logical algorithm.
Thus, the system is described as a switched linear system. In the second
step the model predictive control method is employed to design the
thermal and power management/balancing controller.
