In Thermal and Power Management of Integrated Circuits, power and
thermal management issues in integrated circuits during normal operating
conditions and stress operating conditions are addressed. Thermal
management in VLSI circuits is becoming an integral part of the design,
test, and manufacturing. Proper thermal management is the key to achieve
high performance, quality and reliability. Performance and reliability
of integrated circuits are strong functions of the junction temperature.
A small increase in junction temperature may result in significant
reduction in the device lifetime.
This book reviews the significance of the junction temperature as a
reliability measure under nominal and burn-in conditions. The latest
research in the area of electro-thermal modeling of integrated circuits
will also be presented. Recent models and associated CAD tools are
covered and various techniques at the circuit and system levels are
reviewed. Subsequently, the authors provide an insight into the concept
of thermal runaway and how it may best be avoided. A section on low
temperature operation of integrated circuits concludes the book.