John H Lau
(Author)Semiconductor Advanced Packaging (2021)Paperback - 2021, 19 May 2022
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Print Length
498 pages
Language
English
Publisher
Springer
Date Published
19 May 2022
ISBN-10
9811613788
ISBN-13
9789811613784
Product Details
Author:
Book Edition:
2021
Book Format:
Paperback
Country of Origin:
NL
Date Published:
19 May 2022
Dimensions:
23.39 x
15.6 x
2.67 cm
ISBN-10:
9811613788
ISBN-13:
9789811613784
Language:
English
Location:
Singapore
Pages:
498
Publisher:
Weight:
721.21 gm