Power Electronic Packaging presents an in-depth overview of power
electronic packaging design, assembly, reliability and modeling. Since
there is a drastic difference between IC fabrication and power
electronic packaging, the book systematically introduces typical power
electronic packaging design, assembly, reliability and failure analysis
and material selection so readers can clearly understand each task's
unique characteristics. Power electronic packaging is one of the fastest
growing segments in the power electronic industry, due to the rapid
growth of power integrated circuit (IC) fabrication, especially for
applications like portable, consumer, home, computing and automotive
electronics. This book also covers how advances in both semiconductor
content and power advanced package design have helped cause advances in
power device capability in recent years. The author extrapolates the
most recent trends in the book's areas of focus to highlight where
further improvement in materials and techniques can drive continued
advancements, particularly in thermal management, usability, efficiency,
reliability and overall cost of power semiconductor solutions
