Dean L Monthei

(Author)

Package Electrical Modeling, Thermal Modeling, and Processing for GAAS Wireless Applications (1999)Hardcover - 1999, 30 November 1998

Package Electrical Modeling, Thermal Modeling, and Processing for GAAS Wireless Applications (1999)
Qty
1
Turbo
Ships in 2 - 3 days
In Stock
Free Delivery
Cash on Delivery
15 Days
Free Returns
Secure Checkout
Buy More, Save More
Part of Series
Electronic Packaging and Interconnects
Part of Series
Electronic Packaging and Interconnects Series
Print Length
234 pages
Language
English
Publisher
Springer
Date Published
30 Nov 1998
ISBN-10
0792383648
ISBN-13
9780792383642

Description

This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.

Product Details

Author:
Dean L Monthei
Book Edition:
1999
Book Format:
Hardcover
Country of Origin:
US
Date Published:
30 November 1998
Dimensions:
23.39 x 15.6 x 1.6 cm
ISBN-10:
0792383648
ISBN-13:
9780792383642
Language:
English
Location:
New York, NY
Pages:
234
Publisher:
Weight:
530.7 gm

Related Categories


Need Help?
+971 6 731 0280
support@gzb.ae

About UsContact UsPayment MethodsFAQsShipping PolicyRefund and ReturnTerms of UsePrivacy PolicyCookie Notice

VisaMastercardCash on Delivery

© 2024 White Lion General Trading LLC. All rights reserved.