This book discusses the practical aspects of electrical and thermal
modeling of packages. In addition, processing concerns for plastic
packaged GaAs parts are also covered. The book emphasizes low cost
industry standard packages. However, the principles involved translate
well to other categories of packages. Digital issues such as crosstalk
are well documented in other books and are therefore not covered in
detail in this text. The principles for generation of equivalent circuit
package models applies to both digital and analog parts. Digital
designers and packaging engineers should still find this text useful.
Subtleties often overlooked by standard methods of modeling packages for
digital applications are considered and will become more important to
the digital packaging engineer as frequencies continue to increase. It
is hoped this book will be useful to both microwave and digital
integrated circuit (Ie) designers as well as packaging engineers. In the
past these disciplines were distinct. Packaging engineers typically were
concerned with only materials and mechanical issues of the package. As
long as there was an electrical connection made from the die to the
external pin, packaging engineers had the freedom to do anything they
wanted between these two points. At high frequency the issues change.
Packaging engineers now have to work with die level designers to either
create a package that performs well at high frequencies or to use
readily available low cost packages that happen to meet the needs of the
application.