The series Structure and Bonding publishes critical reviews on topics of
research concerned with chemical structure and bonding. The scope of the
series spans the entire Periodic Table and addresses structure and
bonding issues associated with all of the elements. It also focuses
attention on new and developing areas of modern structural and
theoretical chemistry such as nanostructures, molecular electronics,
designed molecular solids, surfaces, metal clusters and supramolecular
structures. Physical and spectroscopic techniques used to determine,
examine and model structures fall within the purview of Structure and
Bonding to the extent that the focus is on the scientific results
obtained and not on specialist information concerning the techniques
themselves. Issues associated with the development of bonding models and
generalizations that illuminate the reactivity pathways and rates of
chemical processes are also relevant. The individual volumes in the
series are thematic. The goal of each volume is to give the reader,
whether at a university or in industry, a comprehensive overview of an
area where new insights are emerging that are of interest to a larger
scientific audience. Thus each review within the volume critically
surveys one aspect of that topic and places it within the context of the
volume as a whole. The most significant developments of the last 5 to 10
years should be presented using selected examples to illustrate the
principles discussed. A description of the physical basis of the
experimental techniques that have been used to provide the primary data
may also be appropriate, if it has not been covered in detail elsewhere.
The coverage need not be exhaustive in data, but should rather be
conceptual, concentrating on the new principles being developed that
will allow the reader, who is not a specialist in the area covered, to
understand the data presented. Discussion of possible future research
directions in the area is welcomed. Review articles for the individual
volumes are invited by the volume editors. Readership: research
scientists at universities or in industry, graduate students Special
offer for all customers who have a standing order to the print version
of Structure and Bonding, we offer free access to the electronic volumes
of the Series published in the current year via SpringerLink.
