Micromachined Ultrasound-Based Proximity Sensors presents a packaged
ultrasound microsystem for object detection and distance metering based
on micromachined silicon transducer elements. It describes the
characterization, optimization and the long-term stability of silicon
membrane resonators as well as appropriate packaging for ultrasound
microsystems.
Micromachined Ultrasound-Based Proximity Sensors describes a
cost-effective approach to the realization of a micro electro mechanical
system (MEMS). The micromachined silicon transducer elements were
fabricated using industrial IC technology combined with standard silicon
micromachining techniques. Additionally, this approach allows the
cointegration of the driving and read-out circuitry. To ensure the
industrial applicability of the fabricated transducer elements intensive
long-term stability and reliability tests were performed under various
environmental conditions such as high temperature and humidity.
Great effort was undertaken to investigate the packaging and housing of
the ultrasound system, which mainly determine the success or failure of
an industrial microsystem. A low-stress mounting of the transducer
element minimizes thermomechanical stress influences. The developed
housing not only protects the silicon chip but also improves the
acoustic performance of the transducer elements.
The developed ultrasound proximity sensor system can determine object
distances up to 10 cm with an accuracy of better than 0.8 mm.
Micromachined Ultrasound-Based Proximity Sensors will be of interest
to MEMS researchers as well as those involved in solid-state sensor
development.
