This thoroughly revised and updated three volume set continues to be the
standard reference in the field, providing the latest in
microelectronics design methods, modeling tools, simulation techniques,
and manufacturing procedures. Unlike reference books that focus only on
a few aspects of microelectronics packaging, these outstanding volumes
discuss state-of-the-art packages that meet the power, cooling,
protection, and interconnection requirements of increasingly dense and
fast microcircuitry. Providing an excellent balance of theory and
practical applications, this dynamic compilation features step-by-step
examples and vital technical data, simplifying each phase of package
design and production. In addition, the volumes contain over 2000
references, 900 figures, and 250 tables.
Part I: Technology Drivers covers the driving force of
microelectronics packaging - electrical, thermal, and reliability. It
introduces the technology developer to aspects of manufacturing that
must be considered during product development.
Part II: Semiconductor Packaging discusses the interconnection of the
IC chip to the first level of packaging and all first level packages.
Electrical test, sealing, and encapsulation technologies are also
covered in detail.
Part III: Subsystem Packaging explores board level packaging as well
as connectors, cables, and optical packaging.
