The series Structure and Bonding publishes critical reviews on topics of
research concerned with chemical structure and bonding. The scope of the
series spans the entire Periodic Table and addresses structure and
bonding issues associated with all of the elements. It also focuses
attention on new and developing areas of modern structural and
theoretical chemistry such as nanostructures, molecular electronics,
designed molecular solids, surfaces, metal clusters and supramolecular
structures. Physical and spectroscopic techniques used to determine,
examine and model structures fall within the purview of Structure and
Bonding to the extent that the focus is on the scientific results
obtained and not on specialist information concerning the techniques
themselves. Issues associated with the development of bonding models and
generalizations that illuminate the reactivity pathways and rates of
chemical processes are also relevant.
The individual volumes in the series are thematic. The goal of each
volume is to give the reader, whether at a university or in industry, a
comprehensive overview of an area where new insights are emerging that
are of interest to a larger scientific audience. Thus each review within
the volume critically surveys one aspect of that topic and places it
within the context of the volume as a whole. The most significant
developments of the last 5 to 10 years should be presented using
selected examples to illustrate the principles discussed. A description
of the physical basis of the experimental techniques that have been used
to provide the primary data may also be appropriate, if it has not been
covered in detail elsewhere. The coverage need not be exhaustive in
data, but should rather be conceptual, concentrating on the new
principles being developed that will allow the reader, who is not a
specialist in the area covered, to understand the data presented.
Discussion of possible future research directions in the area is
welcomed. Review articles for the individual volumes are invited by the
volume editors.
Readership: research scientists at universities or in industry, graduate
students
Special offer
For all customers who have a standing order to the print version of
Structure and Bonding, we offer free access to the electronic volumes of
the Series published in the current year via SpringerLink.
