Covering the major topics in lead-free soldering
Lead-free Soldering Process Development and Reliability provides a
comprehensive discussion of all modern topics in lead-free soldering.
Perfect for process, quality, failure analysis and reliability engineers
in production industries, this reference will help practitioners address
issues in research, development and production.
Among other topics, the book addresses:
- Developments in process engineering (SMT, Wave, Rework, Paste
Technology)
- Low temperature, high temperature and high reliability alloys
- Intermetallic compounds
- PCB surface finishes and laminates
- Underfills, encapsulants and conformal coatings
- Reliability assessments
In a regulatory environment that includes the adoption of mandatory
lead-free requirements in a variety of countries, the book's
explanations of high-temperature, low-temperature, and high-reliability
lead-free alloys in terms of process and reliability implications are
invaluable to working engineers.
Lead-free Soldering takes a forward-looking approach, with an eye
towards developments likely to impact the industry in the coming years.
These will include the introduction of lead-free requirements in
high-reliability electronics products in the medical, automotive, and
defense industries. The book provides practitioners in these and other
segments of the industry with guidelines and information to help comply
with these requirements.
