This Second Edition focuses on emerging topics and advances in the field
of VLSI interconnections
In the decade since High-Speed VLSI Interconnections was first
published, several major developments have taken place in the field.
Now, updated to reflect these advancements, this Second Edition includes
new information on copper interconnections, nanotechnology circuit
interconnects, electromigration in the copper interconnections,
parasitic inductances, and RLC models for comprehensive analysis of
interconnection delays and crosstalk.
Each chapter is designed to exist independently or as a part of one
coherent unit, and several appropriate exercises are provided at the end
of each chapter, challenging the reader to gain further insight into the
contents being discussed. Chapter subjects include:
*
Preliminary Concepts
*
Parasitic Resistances, Capacitances, and Inductances
*
Interconnection Delays
*
Crosstalk Analysis
*
Electromigration-Induced Failure Analysis
*
Future Interconnections
High-Speed VLSI Interconnections, Second Edition is an indispensable
reference for high-speed VLSI designers, RF circuit designers, and
advanced students of electrical engineering.