High-Frequency Characterization of Electronic Packaging will be of
interest to researchers and designers of high-frequency electronic
packaging. Understanding high-frequency behavior of packaging is of
growing importance due to higher clock-speeds in computers and higher
data transmission rates in broadband telecommunication systems. Basic
knowledge of the high-frequency behavior of packaging and interconnects
is, therefore, indispensable for the design of future telecommunication
and computer systems.
High-Frequency Characterization of Electronic Packaging gives the
reader an insight into how high-frequency characterization of electronic
packaging should be done and describes the problems that have to be
tackled, especially in performing accurate measurements on modern
IC-packages and in determination of circuit models.
High-Frequency Characterization of Electronic Packaging is conceived
as a comprehensive guide for the start of research and to help in
performing high-frequency measurements. Important notions in high-
frequency characterization such as S-parameters, calibration, probing,
de-embedding and measurement-based modeling are explained. The described
techniques are illustrated with several up-to-date examples.