Heat Capacity and Thermal Expansion at Low Temperatures (Softcover Reprint of the Original 1st 1999)Paperback - Softcover Reprint of the Original 1st 1999, 25 September 2012

The birth of this monograph is partly due to the persistent efforts of the General Editor, Dr. Klaus Timmerhaus, to persuade the authors that they encapsulate their forty or fifty years of struggle with the thermal properties of materials into a book before they either expired or became totally senile. We recognize his wisdom in wanting a monograph which includes the closely linked properties of heat capacity and thermal expansion, to which we have added a little 'cement' in the form of elastic moduli. There seems to be a dearth of practitioners in these areas, particularly among physics postgraduate students, sometimes temporarily alleviated when a new generation of exciting materials are found, be they heavy fermion compounds, high- temperature superconductors, or fullerenes. And yet the needs of the space industry, telecommunications, energy conservation, astronomy, medical imaging, etc., place demands for more data and understanding of these properties for all classes of materials - metals, polymers, glasses, ceramics, and mixtures thereof. There have been many useful books, including Specific Heats at Low Tempera- tures by E. S. Raja Gopal (1966) in this Plenum Cryogenic Monograph Series, but few if any that covered these related topics in one book in a fashion designed to help the cryogenic engineer and cryophysicist. We hope that the introductory chapter will widen the horizons of many without a solid state background but with a general interest in physics and materials.