Handbook of tape automated bonding (TAB) is a one-stop guide to the
state of the art of TAB technology - including TAB tape, bump, inner
lead bonding, encapsulation, testing, burn-in, outer lead bonding,
inspection, rework, thermal management and reliability. For
professionals active in TAB research and development, those who wish to
master TAB problem solving methods, and those who must choose a
high-performance and cost-effective packaging technique for their
interconnect systems, here's a timely summary of progress in all aspects
of this fascinating field.