L P Yarin

(Author)

Fluid Flow, Heat Transfer and Boiling in Micro-Channels (2009)Hardcover - 2009, 13 October 2008

Fluid Flow, Heat Transfer and Boiling in Micro-Channels (2009)
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Part of Series
Heat and Mass Transfer
Print Length
496 pages
Language
English
Publisher
Springer
Date Published
13 Oct 2008
ISBN-10
3540787542
ISBN-13
9783540787549

Description

The subject of the book is uid dynamics and heat transfer in micro-channels. This problem is important for understanding the complex phenomena associated with single- and two-phase ows in heated micro-channels. The challenge posed by high heat uxes in electronic chips makes thermal management a key factor in the development of these systems. Cooling of mic- electronic components by new cooling technologies, as well as improvement of the existing ones, is becoming a necessity as the power dissipation levels of integrated circuits increases and their sizes decrease. Miniature heat sinks with liquid ows in silicon wafers could signi cantly improve the performance and reliability of se- conductor devices. The improvements are made by increasing the effective thermal conductivity, by reducing the temperature gradient across the wafer, by reducing the maximum wafer temperature, and also by reducing the number and intensity of localized hot spots. A possible way to enhance heat transfer in systems with high power density is to change the phase in the micro-channels embedded in the device. This has motivated a number of theoretical and experimental investigations covering various aspects of heat transfer in micro-channel heat sinks with phase change. The ow and heat transfer in heated micro-channels are accompanied by a n- ber of thermohydrodynamic processes, such as liquid heating and vaporization, bo- ing, formation of two-phase mixtures with a very complicated inner structure, etc., which affect signi cantly the hydrodynamic and thermal characteristics of the co- ing systems.

Product Details

Authors:
L P YarinA MosyakG Hetsroni
Book Edition:
2009
Book Format:
Hardcover
Country of Origin:
DE
Date Published:
13 October 2008
Dimensions:
23.62 x 16 x 2.29 cm
ISBN-10:
3540787542
ISBN-13:
9783540787549
Language:
English
Location:
Berlin, Heidelberg
Pages:
496
Publisher:
Weight:
793.79 gm

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