John H Lau
(Author)Fan-Out Wafer-Level Packaging (2018)Hardcover - 2018, 13 April 2018
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Print Length
303 pages
Language
English
Publisher
Springer
Date Published
13 Apr 2018
ISBN-10
9811088837
ISBN-13
9789811088834
Product Details
Author:
Book Edition:
2018
Book Format:
Hardcover
Country of Origin:
NL
Date Published:
13 April 2018
Dimensions:
23.39 x
15.6 x
1.91 cm
ISBN-10:
9811088837
ISBN-13:
9789811088834
Language:
English
Location:
Singapore
Pages:
303
Publisher:
Weight:
630.49 gm