Although exploratory and developmental activity in electron beam testing
(EBT) 25 years, it was not had already been in existence in research
laboratories for over until the beginning of the 1980s that it was taken
up seriously as a technique for integrated circuit (IC) testing. While
ICs were being fabricated on design rules of several microns, the
mechanical ne edle probe served quite adequately for internal chip
probing. This scenario changed with growing device complexity and
shrinking geometries, prompting IC manufacturers to take note ofthis new
testing technology. It required several more years and considerable
investment by electron beam tester manufacturers, however, to co me up
with user-friendly automated systems that were acceptable to IC test
engineers. These intervening years witnessed intense activity in the
development of instrumentation, testing techniques, and system
automation, as evidenced by the proliferation of technical papers
presented at conferences. With the shift of interest toward
applications, the technology may now be considered as having come of
age.