This critical volume provides an in-depth presentation of copper wire
bonding technologies, processes and equipment, along with the economic
benefits and risks. Due to the increasing cost of materials used to make
electronic components, the electronics industry has been rapidly moving
from high cost gold to significantly lower cost copper as a wire bonding
material. However, copper wire bonding has several process and
reliability concerns due to its material properties. Copper Wire
Bonding book lays out the challenges involved in replacing gold with
copper as a wire bond material, and includes the bonding process
changes-bond force, electric flame off, current and ultrasonic energy
optimization, and bonding tools and equipment changes for first and
second bond formation. In addition, the bond-pad metallurgies and the
use of bare and palladium-coated copper wires on aluminum are presented,
and gold, nickel and palladium surface finishes are discussed. The book
also discusses best practices and recommendations on the bond process,
bond-pad metallurgies, and appropriate reliability tests for copper
wire-bonded electronic components.
In summary, this book:
- Introduces copper wire bonding technologies
- Presents copper wire bonding processes
- Discusses copper wire bonding metallurgies
- Covers recent advancements in copper wire bonding including the
bonding process, equipment changes, bond-pad materials and surface
finishes
- Covers the reliability tests and concerns
- Covers the current implementation of copper wire bonding in the
electronics industry
- Features 120 figures and tables
Copper Wire Bonding is an essential reference for industry
professionals seeking detailed information on all facets of copper wire
bonding technology.
