John H Lau

(Author)

Chip on Board: Technology for Multichip Modules (1994)Hardcover - 1994, 30 June 1994

Chip on Board: Technology for Multichip Modules (1994)
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Part of Series
E; Ectrical Engineering
Print Length
556 pages
Language
English
Publisher
Springer
Date Published
30 Jun 1994
ISBN-10
0442014414
ISBN-13
9780442014414

Description

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master COB and MCM problem-solving methods, and those who must choose a cost-effective design and high-yield manufacturing process for their interconnect systems, here is a timely summary of progress in al aspects of this fascinating field.
It meets the reference needs of design, material, process, equipment, manufacturing, quality, reliability, packaging, and system engineers, and technical managers working in electronic packaging and interconnection.

Product Details

Author:
John H Lau
Book Edition:
1994
Book Format:
Hardcover
Country of Origin:
US
Date Published:
30 June 1994
Dimensions:
23.77 x 15.24 x 3.4 cm
ISBN-10:
0442014414
ISBN-13:
9780442014414
Language:
English
Location:
New York, NY
Pages:
556
Publisher:
Weight:
925.33 gm

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