New MOSFET architectures are presently being developed in which
dielectrics with high permittivity are introduced to replace SiO2-based
dielectrics, which are at the end of the scaling roadmap, and where also
metal gates are used to replace poly-Si gate to avoid poly-depletion
effects. Key in the success of this development is the electrical
behavior of such high k/metal gate devices, and more specifically the
Bias-Temperature- Instabilities, which are well-known reliability
problems in MOS gate stacks. In this thesis, these Bias-Temperature
effects will be investigated: the electrical behavior of the devices
under Bias- Temperature stress will be characterized, models to explain
the instability effects will be developed, the impact of processing,
material composition and deposition techniques, annealing conditions
etc. will be investigated, and ways to improve these BTI effects will be
proposed. This work should ultimately lead to optimized gate stacks with
higher BTI robustness