In Dynamic Random Access Memory, every cell experiences leakage current
which consumes part of the stored charge. As the DRAM cell size is
shrinking, the leakage is increasing. To maintain the desired data
retention time, the leakage current must be kept within the acceptable
limit. So, leakage reduction in memories is a topic of great challenge
and interest in researchers. This book presents the analysis and design
of a DRAM cell for low leakage. For the analysis, trench capacitor DRAM
cell has been considered. For the design of trench capacitor DRAM cell,
0.18 μm submicron nMOSFET as access transistor and the conventional
trench capacitor as storage device have been considered. Various DRAM
cell structures, leakage mechanisms in a DRAM cell and process-level
techniques for leakage reduction have been reviewed. Process simulation
and device simulation of DRAM cell have been done using the ATHENA/ATLAS
packages of SILVACO. This book will help the beginners as the book
reviews the previous work done by many researchers and provides the
trends in DRAM cell designs, theoretical knowledge of leakage mechanisms
in DRAM cell and process/device simulation of DRAM cell.